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- Time of issue:2019-10-26 00:00:00
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Wu-zhu's Technology Roadmap 1-MLB
| Item | HLC Advanced Technology | |||
| 2023 | 2024 | 2025 | ||
| Max Panel Width (inch) | 25 | 25 | 25 | |
| Max Panel Length (inch) | 29 | 29 | 29 | |
| Max Layer Count (L) | 16 | 18 | 36 | |
| Max Board thickness (mm) | 3.2 | 4.0 | 6.0 | |
| Max Board thickness Tolerance | +/-10% | +/-10% | +/-10% | |
| Base copper Thickness | Inner layer ( OZ ) | 4 | 6 | 8 |
| Outer Layer ( OZ ) | 2 | 3 | 4 | |
| Min DHS ( mm ) | 0.20 | 0.15 | 0.15 | |
| PTH Size Tolerance ( mil ) | +/-2 | +/-2 | +/-2 | |
| Back Drill (stub)( mil ) | ~ 3 | ~ 2.4 | ~ 2 | |
| Max. AR | 12:1 | 16:1 | 20:1 | |
| Item | HLC Advanced Technology | |||
| 2023 | 2024 | 2025 | ||
| M-drill tolerance | Inner layer ( mil ) | DHS + 10 | DHS + 10 | DHS + 8 |
| Outer Layer ( mil ) | DHS + 8 | DHS + 8 | DHS + 6 | |
| Solder mask Registration (um) | +/- 40 | +/- 30 | +/- 25 | |
| Impedance control | ≥50ohms | +/-10% | +/-10% | -/-8% |
| <50ohms | 5 Ω | 5 Ω | 4 Ω | |
| Min LW/S (Inner) @ 1oz base Cu ( mil ) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 | |
| Min LW/S (Outer) @ 1oz Cu ( mil ) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 | |
| Max dimple for POFV ( um ) | 30 | 20 | 15 | |
| Surface Finishing | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au | |||
Wu-zhu's Technology Roadmap 2–HDI
| Item | HDI Advanced Technology | |||
| 2023 | 2024 | 2025 | ||
| Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
| HDI Stack Via | Any Layer (12L) | Any Layer(14L) | Any Layer(16L) | |
| Board Thickness(mm) | Min. 8L | 0.45 | 0.40 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.40 | |
| Min. 12L | 0.65 | 0.60 | 0.55 | |
| MAX. | 2.40 | |||
| Min. Core Thickness ( um ) | 50 | 40 | 40 | |
| Min. PP Thickness ( um ) | 30（#1027 PP） | 25（#1017 PP） | 20（#1010 PP） | |
| Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
| Item | HDI Advanced Technology | |||
| 2023 | 2024 | 2025 | ||
| Min. Mechanical Drill hole size (um) ** | 200 | 200 | 150 | |
| Max. Through Hole Aspect Ratio * | 8 : 1 | 10 : 1 | 10 : 1 | |
| Min. Laser via / Pad Size ( um ) | 75/ 200 | 70/ 170 | 60/ 150 | |
| Max. Laser Via Aspect Ratio | 0.8 : 1 | 0.8 : 1 | 0.8 : 1 | |
| Laser Via on PTH （VOP）design | Yes | Yes | Yes | |
| Laser X type through hole（DT≤200um） | NA | 60~100um | 60~100um | |
| Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
| Min BGA Pitch (mm) | 0.35 | 0.30 | 0.30 | |
| Item | HDI Advanced Technology | |||
| 2023 | 2024 | 2025 | ||
| Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
| Min. Solder Mask Dam (mm) | 0.070 | 0.060 | 0.050 | |
| PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
| PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
| cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
| Laser directly | +/- 50 | +/- 50 | +/- 50 | |
| Surface Finishing | OSP、ENIG、Immersion Tin、Hard Au、 Immersion Ag | OSP、ENIG、Immersion Tin、Hard Au、Immersion Ag、 ENEPIG | ||
Wu-zhu's Roadmap 3–Flex & R-F
| Item | Flex & Rigid-Flex Technology | ||
| 2024 | 2025 | ||
| Flex Layer Count | 6 | 8 | |
| Roll Width/PNL Size( mm ) | Roll Width (inner layer) | 250 | 500 |
| Working PNL Size | 250 x 250 ~ 500 | 500 x 610 | |
| Min Line / Space ( um ) (L/S/Cu thickness) |
Inner layer with CF | 40 /40 / 12 50 /50 /18 |
35 /35 /12 45 /45 /18 |
| Outer layer with plated Cu | 55 /55 / 25 63 /63 /35 |
50 /50 /25 55 /55 /35 |
|
| Via Structure | Laser blind via size (um) | 75 | 65 |
| Stacked via structure | Y | Y | |
| Laser through via ( um ) | 100 | 75 | |
| M-drill hole size ( um ) | 150 | 100 | |
| Min Pad size ( um ) | Inner layer with CF | D + 225 | D + 175 |
| Outer layer with plated Cu | D + 200 | D + 150 | |
| Button plating | D + 250 | D + 200 | |
| Item | Flex & Rigid-Flex Technology | ||
| 2024 | 2025 | ||
| Cover-layer ( um ) | Registration | +/- 150 | +/- 125 |
| Solder mask ( um ) | Registration | +/- 50 | +/- 37.5 |
| Dam capability | 100 | 75 | |
| E-test SMT pitch ( um ) | Dam capability | 200 | 150 |
| Flying probe | 100 | 100 | |
| Rigid-Flex Technology | Flying probe | Up to 4 w air gap | Up to 4 w air gap |
| Rigid-Flex layer count | Up to 12 | Up to 16 | |
| Max. Rigid-Flex PNL size ( mm ) | ~ 250 x 400 | ~ 500 x 610 | |
| Max. Rigid-Flex PNL size ( mm ) | 25 | 12 | |
| Min rigid layer thickness ( um ) | # 1037 & # 1027 | # 1017 | |
| Surface finishing | ENIG, ENEPIG, Hard Au, OSP | ||
Wu-zhu's Technology Roadmap 4–SMT capability
| Item | SMT Capability | |||
| 2023 | 2024 | 2025 | ||
| Min board thickness ( mm ) | 0.1 | 0.06 | 0.05 | |
| Max. board size ( mm ) | 200 x 250 | 250 x 300 | 250 x 350 | |
| Chip component ( L, C, R etc. ) | Minimum size | 01005 | 01005 | 01005 |
| Connector | 0.5 mm pitch | Y | Y | Y |
| 0.4 mm pitch | Y | Y | Y | |
| 0.35 mm pitch | Y | Y | Y | |
| High density component : TSOP, QFP, QFN, LGA, BGA etc. |
0.5 mm pitch | Y | Y | Y |
| 0.4 mm pitch | Y | Y | Y | |
| 0.35 mm pitch | Y | Y | Y | |
| Reflow | N2 reflow | No | Y | Y |
| Under-fill | Fill under chip | Manual | Auto | Auto |
| ACF attach | Gold finger pitch | N/A | 0.3 mm | 0.2 mm |
| Inspection | Component position, direction, missing etc. | Manual check with 10 x scope | Auto AOI inspection | Auto AOI inspection |
| Solder paste thickness | Measure once per shift | 1 line auto full area, online SPI | All lines auto full area, online SPI | |
Wu-zhu's Technology Roadmap 4–Materials
| ITEM | EMC | Doosan | ITEQ | TUC | Shengyi | Hitach | Panasonic | Isola | |
| Mid-TG | EM-825 | IT-158 | S-1000 | ||||||
| Mid-TG, HF | Normal Dk | EM-285 EM-370(5) |
S-1150G | R-1566WN | |||||
| Low Dk | EM-355(D) | TU-747LK | |||||||
| High-TG HF |
Normal Dk | EM-370(D) | IT-170G | S-1170G | |||||
| Low CTE | EM-370（Z） | TU-862T | |||||||
| Low Dk | EM-390 | TU-787LK | E-78G | R-A555W | |||||
| Low Loss | 0.01~0.015 | EM-888 | DS-7409D(X) | IT-200LK | TU863+ | HE-679GS | Megtron4 | FR408HR | |
| 0.01~0.015 | EM-528 | DS-7409DV | IT-968 | Thunderclad 2 (TU-883) |
Synamic4 (S7439) |
HE-679GS | Megtron6/7 | Terragreen | |
| < 0.005 | EM-890 | DS7409DV(N) | IT-988G | Thunderclad 3 (TU-933) |
Synamic6G | LW-910G | Megtron7(N) | Astra MT77 | |
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Tel：0086-797 357 2666 / 400-838-6928
E-mail：grl@topcb.com.cn / web@topcb.com.cn
Copyright © 2019 Wuzhu Technology Co., Ltd. 粤ICP备15063227号
Jiangxi Zhihao Electronic Technology Co., Ltd
Address: Xinzhen Industrial Park, Longnan ec, GanZhou City,GanZhou City, Jiangxi, China (341700)
Tel: (86 0797) 3572666 Fax: (86 0797) 3572666
E-mail： web@topcb.com.cn / grl@topcb.com.cn