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Description:
Information
Wu-zhu's Technology Roadmap 1-MLB
Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4.0 6.0
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.20 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8   DHS + 8   DHS + 6  
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)  @ 1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)  @ 1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au
Wu-zhu's Technology Roadmap 2–HDI
Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via Any Layer (12L) Any Layer(14L) Any Layer(16L)
Board Thickness(mm) Min. 8L 0.45 0.40 0.35
Min. 10L 0.55 0.45 0.40
Min. 12L 0.65 0.60 0.55
MAX.   2.40  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness  ( um ) 30(#1027 PP) 25(#1017 PP) 20(#1010 PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size  (um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8 : 1 10 : 1 10 : 1
Min. Laser via /  Pad Size ( um ) 75/ 200 70/ 170 60/ 150
Max. Laser Via  Aspect Ratio 0.8 : 1 0.8 : 1 0.8 : 1
Laser Via on PTH (VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.30 0.30
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.070 0.060 0.050
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth  accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP、ENIG、Immersion Tin、Hard Au、 Immersion Ag OSP、ENIG、Immersion Tin、Hard Au、Immersion Ag、 ENEPIG
Wu-zhu's Roadmap 3–Flex & R-F
Item Flex & Rigid-Flex Technology
2019 2020
Flex Layer Count 6 8
Roll Width/PNL Size( mm ) Roll Width (inner layer) 250 500
Working PNL Size 250 x 250 ~ 500 500 x 610
Min Line / Space ( um )
(L/S/Cu thickness)
Inner layer with CF 40 /40 / 12
50 /50 /18
35 /35 /12
45 /45 /18
Outer layer with plated Cu 55 /55 / 25
63 /63 /35
50 /50 /25
55 /55 /35
Via Structure Laser blind via size (um) 75 65
Stacked via structure Y Y
Laser through via ( um ) 100 75
M-drill hole size ( um ) 150 100
Min Pad size ( um ) Inner layer with CF D + 225 D + 175
Outer layer with plated Cu D + 200 D + 150
Button plating D + 250 D + 200
Item Flex & Rigid-Flex Technology
2019 2020
Cover-layer ( um ) Registration +/- 150 +/- 125
Solder mask ( um ) Registration +/- 50 +/- 37.5
Dam capability 100 75
E-test SMT pitch ( um ) Dam capability 200 150
Flying probe 100 100
Rigid-Flex Technology Flying probe Up to 4 w air gap Up to 4 w air gap
Rigid-Flex layer count Up to 12 Up to 16
Max. Rigid-Flex PNL size ( mm ) ~ 250 x 400 ~ 500 x 610
Max. Rigid-Flex PNL size ( mm ) 25 12
Min rigid layer thickness ( um ) # 1037 & # 1027 # 1017
Surface finishing ENIG,  ENEPIG,  Hard Au,  OSP
Wu-zhu's Technology Roadmap 4–SMT capability
Item SMT Capability
2019 2020 2021
Min board thickness ( mm ) 0.1 0.06 0.05
Max. board size ( mm ) 200 x 250 250 x 300 250 x 350
Chip component ( L, C, R etc. ) Minimum size 01005 01005 01005
Connector 0.5 mm pitch Y Y Y
0.4 mm pitch Y Y Y
0.35 mm pitch Y Y Y
High density component :
TSOP, QFP, QFN, LGA, BGA etc.
0.5 mm pitch Y Y Y
0.4 mm pitch Y Y Y
0.35 mm pitch Y Y Y
Reflow N2 reflow No Y Y
Under-fill Fill under chip Manual Auto Auto
ACF attach Gold finger pitch N/A 0.3 mm 0.2 mm
Inspection Component position, direction, missing etc. Manual check with 10 x scope Auto AOI inspection Auto AOI inspection
Solder paste thickness Measure once per shift 1 line auto full area, online SPI All lines auto full area, online SPI
Wu-zhu's Technology Roadmap 4–Materials
ITEM EMC Doosan ITEQ TUC Shengyi Hitach Panasonic Isola
Mid-TG EM-825   IT-158   S-1000      
Mid-TG, HF Normal Dk EM-285
EM-370(5)
      S-1150G   R-1566WN  
Low Dk EM-355(D)     TU-747LK        
High-TG
HF
Normal Dk EM-370(D)   IT-170G   S-1170G      
Low CTE EM-370(Z)     TU-862T        
Low Dk EM-390     TU-787LK   E-78G R-A555W  
Low Loss 0.01~0.015 EM-888 DS-7409D(X) IT-200LK TU863+   HE-679GS Megtron4 FR408HR
0.01~0.015 EM-528 DS-7409DV IT-968 Thunderclad 2
(TU-883)
Synamic4
(S7439)
HE-679GS Megtron6/7 Terragreen
< 0.005 EM-890 DS7409DV(N) IT-988G Thunderclad 3
(TU-933)
Synamic6G LW-910G Megtron7(N) Astra MT77

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Process capability
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