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High-frequency mixed pressure
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High-frequency mixed pressure

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Number of floors: 4L
Board thickness: 1.5mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.152mil / 0.152mil
Uses: Amplifier
Product serial number
Category
High layer
Quantity
-
+
Stock:
0

Number of floors: 4L

Board thickness: 1.5mm

Copper thickness: 1oz

Surface treatment: chemical nickel gold

Line width and space: 0.152mil / 0.152mil

Uses: Amplifier

Technical features: The product is used in communication power amplifier modules. The RO4350B is mixed with FR-4. The top metal slot is designed to have a copper-free depth of 0.5mm. The thermal stability of the product is more than three times that of ordinary FR-4.

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