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One stop, multi varieties, high-end PCB manufacturers in large quantities

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Product introduction

The main products are widely used in network and communication infrastructure, smart phones, high-end servers, computers and storage, tablet computers, high-end consumer electronics, artificial intelligence hardware, industrial control, medical, automotive electronics, new energy, aerospace and national defense and other fields. The products have the characteristics of one-stop and multi varieties, covering the types of precision single / double-sided board, high-precision multilayer board, high-density interconnection circuit board (HDI), flexible board (FPC), soft and hard combination board (RFPC), special base plate (high frequency board, thick copper board, copper base plate, aluminum base plate, etc.). With nearly 20 years of experience and technology accumulation, wuzhu group has established a leading technology advantage in the field of printed circuit board.

五株集团
Consumer (Smartphone)55%
五株集团
Consumer (Smartphone)55%
五株集团
Communication15%
五株集团
Communication15%
五株集团
Computer10%
五株集团
Computer10%
五株集团
Industrial/medical10%
五株集团
Industrial/medical10%
五株集团
Automobile5%
五株集团
Automobile5%
五株集团
Aviation and military5%
五株集团
Aviation and military5%
All categories
Automotive radar
Number of floors: 6L
Board thickness: 1.5mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.10mil / 0.10mil
Uses: blind spot monitoring system
Technical characteristics: multi-layer heigh plus
High-layer version
Number of floors: 10L
Board thickness: 2.4mm
Copper thickness: 1oz
Surface treatment: OSP
Line width and space: 0.10mil / 0.10mil
Application: High-performance computer
Technical characteristics: multi-layer heigh plus
Automotive radar
Number of floors: 6L
Board thickness: 1.5mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.10 mil/ 0.10mil
Uses: blind spot monitoring system
Technical characteristics: FR4 + high-frequency material mixed pressure, high requirements for antenna array etching
Multilayer 4oz thick copper plate
Number of floors: 12L
Board thickness: 3.2mm
Copper thickness: 3/4 / 3oz
Surface treatment: chemical nickel gold
Line width and space: 0.25 mil/ 0.25mil
Uses: base station power
Technical characteristics: The product is applied to small base station power supply, the thickness of copper in the hole is 70um, the via hole is plugged with resin, the thickness of copper in the inner layer is 4oz, and the thickness of the outer layer is 3oz.
Backplane
Number of floors: 10L
Board thickness: 4.0mm
Copper thickness: 1
Surface treatment: osp
Line width and space: 0.127mil / 0.127mil
Purpose: Communication
Technical characteristics: large size, high plate thickness
High frequency board
Number of floors: 2L
Board thickness: 0.65mm
Copper thickness: 1oz
Surface treatment: Shen tin
Line width and space: 0.18mil / 0.18mil
Uses: high-frequency communication
Technical characteristics: strict line tolerance
High-frequency mixed pressure
Number of floors: 4L
Board thickness: 1.5mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.152mil / 0.152mil
Uses: Amplifier
Copper plate
Number of floors: 12L
Board thickness: 3.6mm
Copper thickness: 3oz
Surface treatment: chemical nickel gold
Line width and space: 0.25mil / 0.25mil
Use: Large equipment
Technical characteristics: aspect ratio of through hole 10: 1; difficult to prevent silk screen
Antenna board
Number of floors: 2L
Board thickness: 0.96mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.381mil / 0.203mil
Application: 5G base station antenna
Technical characteristics: RO4730 sheet has dense shielding holes
High layer
Number of floors: 20L
Board thickness: 3mm
Copper thickness: 2oz
Surface treatment: ENIG
Line width and space: 4.0mil / 4.0mil
Technical characteristics: Thick plate
Optical module
Number of floors: 4L
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: electric gold + local electric thick gold
Line width and space: 0.10mil / 0.10mil
Application: communication optical module
Thickness tolerance: ± 0.05mm
High multilayer board
Number of floors: 8L
Board thickness: 2.0mm
Copper thickness: 2oz
Surface treatment: Lead-free tin spray
Line width and space: 0.2mil / 0.20mil
Use: Network communication
High multilayer board
Number of floors: 10L
Board thickness: 2.0mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.127mil/0.127mil
Purpose: Network communication
Technical characteristics: Impedance control
High multilayer board
Number of floors: 8L
Board thickness: 1.60mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold + gold finger
Line width and space: 0.102mil / 0.127mil
Use: display control
Technical characteristics: chemical nickel gold + gold finger
High multilayer board
Number of floors: 18L
Board thickness: 3.2mm
Copper thickness: 1oz
Surface treatment: Shen tin
Line width and space: 0.127mil / 0.127mil
Use: Network communication
Technical features: Back-drilled POFV
High multilayer board
Number of floors: 6L
Board thickness: 1.2mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.10mil / 0.10mil
Use: Financial terminal
Technical characteristics: Bonding IC dense
High multilayer board
Number of floors: 6L
Board thickness: 2.0mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold + electric hard gold
Line width and space: 0.178mil / 0.178mil
Use: Financial terminal
Technical characteristics: chemical nickel gold + electric hard gold + blind slot
High multilayer board
Number of floors: 4L
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.10mil / 0.10mil
Use: Financial terminal
Technical characteristics: metallized half hole
High multilayer board
Number of floors: 4L
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.10mil / 0.127mil
Use: Financial terminal
High multilayer board
Number of floors: 6L
Board thickness: 1.2mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.10mil / 0.127mil
Use: Industrial control
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