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One stop, multi varieties, high-end PCB manufacturers in large quantities

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Product introduction

The main products are widely used in network and communication infrastructure, smart phones, high-end servers, computers and storage, tablet computers, high-end consumer electronics, artificial intelligence hardware, industrial control, medical, automotive electronics, new energy, aerospace and national defense and other fields. The products have the characteristics of one-stop and multi varieties, covering the types of precision single / double-sided board, high-precision multilayer board, high-density interconnection circuit board (HDI), flexible board (FPC), Rigid-flex PCB(RFPCB), special materials (high frequency board, thick copper board, copper base board, aluminum base board, etc.). With nearly 30 years of experience and technology accumulation, Wuzhu Group has established a leading technology advantage in the field of printed circuit board.

五株集团
Consumer (Smartphone)55%
五株集团
Consumer (Smartphone)55%
五株集团
Communication15%
五株集团
Communication15%
五株集团
Computer10%
五株集团
Computer10%
五株集团
Industrial/medical10%
五株集团
Industrial/medical10%
五株集团
Automobile5%
五株集团
Automobile5%
五株集团
Aviation and military5%
五株集团
Aviation and military5%
All categories
3+8+3
Number of layers: 14L
Order: 3
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3mil / 3mil
Application: wearable products
Technical characteristics: Multi-layer heigh plus
2+6+2
Number of layers: 10L
Order: 2
Board thickness: 0.9mm
Copper thickness: 1oz
Surface treatment: ENIG
Line width and space: 3mil / 3mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
2+4+2
Number of layers: 8L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.3mil / 2.3mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
2+6+2
Number of layers: 10L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.3mil / 2.3mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
3+4+3
Number of layers: 10L
Order: 3
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
1+4+1
Number of layers: 6L
Order: 1
Board thickness: 0.8mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: E-book
1+4+1
Number of layers: 6L
Order: 1
Board thickness: 0.6mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Navigation
2+4+2
Number of layers: 8L
Order: 1
Board thickness: 0.65mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
1+6+1
Number of layers: 8L
Order: 1
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.5mil / 2.5mil
Application: Tablet
2+4+2
Number of layers: 8L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
2+2+2
Number of layers: 6L
Order: 2
Board thickness: 0.75mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
1+6+1
Number of layers: 8L
Order: 1
Board thickness: 1.6mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
2+2+2
Number of layers: 6L
Order: 2
Board thickness: 0.75mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
4+2+4
Number of layers: 10L
Order: 4
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
2+2+2
Number of layers: 6L
Order: 2
Board thickness: 1.2mm
Copper thickness: 1oz
Surface treatment: ENIG
Line width and space: 4.0mil / 4.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
3+2+3
Number of layers: 8L
Order: 3
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
3+4+3
Number of layers: 10L
Order: 3
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
1+4+1
Number of layers: 6L
Order: 1
Board thickness: 1.6mm
Copper thickness: 1oz
Surface treatment: ENIG
Line width and distance: 3.5mil / 3.5mil
Application: Car
10-layer third-order blind buried plate
HDI layer : 20L
Minimum mechanical drilling aperture : 0.15mm
Impedance tolerance: ± 8%
Surface treatment: full board OSP, full board immersion gold, OSP + immersion gold, OSP + carbon oil, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, Shen silver
2+2+2
Number of layers: 6L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.3mil / 2.3mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
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Add:#57, KejizhongRd., Shijie,Dongguan City,Guangdong, China
Tel:0086-797 357 2666 / 400-838-6928
E-mail:grl@topcb.com.cn / web@topcb.com.cn

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Jiangxi Zhihao Electronic Technology Co., Ltd

Address: Xinzhen Industrial Park, Longnan ec, GanZhou City,GanZhou City, Jiangxi, China (341700)
Tel: (86 0797) 3572666     Fax: (86 0797) 3572666   
E-mail: web@topcb.com.cn  / grl@topcb.com.cn