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One stop, multi varieties, high-end PCB manufacturers in large quantities

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Product introduction

The main products are widely used in network and communication infrastructure, smart phones, high-end servers, computers and storage, tablet computers, high-end consumer electronics, artificial intelligence hardware, industrial control, medical, automotive electronics, new energy, aerospace and national defense and other fields. The products have the characteristics of one-stop and multi varieties, covering the types of precision single / double-sided board, high-precision multilayer board, high-density interconnection circuit board (HDI), flexible board (FPC), soft and hard combination board (RFPC), special base plate (high frequency board, thick copper board, copper base plate, aluminum base plate, etc.). With nearly 20 years of experience and technology accumulation, wuzhu group has established a leading technology advantage in the field of printed circuit board.

五株集团
Consumer (Smartphone)55%
五株集团
Consumer (Smartphone)55%
五株集团
Communication15%
五株集团
Communication15%
五株集团
Computer10%
五株集团
Computer10%
五株集团
Industrial/medical10%
五株集团
Industrial/medical10%
五株集团
Automobile5%
五株集团
Automobile5%
五株集团
Aviation and military5%
五株集团
Aviation and military5%
All categories
3+8+3
Number of floors: 14L
Order: 3
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3mil / 3mil
Application: wearable products
Technical characteristics: Multi-layer heigh plus
2+6+2
Number of floors: 10L
Order: 2
Board thickness: 0.9mm
Copper thickness: 1oz
Surface treatment: ENIG
Line width and space: 3mil / 3mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
2+4+2
Number of floors: 8L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.3mil / 2.3mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
2+6+2
Number of floors: 10L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.3mil / 2.3mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
3+4+3
Number of floors: 10L
Order: 3
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
1+4+1
Number of floors: 6L
Order: 1
Board thickness: 0.8mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: E-book
1+4+1
Number of floors: 6L
Order: 1
Board thickness: 0.6mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Navigation
2+4+2
Number of floors: 8L
Order: 1
Board thickness: 0.65mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
1+6+1
Number of floors: 8L
Order: 1
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.5mil / 2.5mil
Application: Tablet
2+4+2
Number of floors: 8L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
2+2+2
Number of floors: 6L
Order: 2
Board thickness: 0.75mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
1+6+1
Number of floors: 8L
Order: 1
Board thickness: 1.6mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
2+2+2
Number of floors: 6L
Order: 2
Board thickness: 0.75mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
4+2+4
Number of floors: 10L
Order: 4
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.0mil / 2.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
2+2+2
Number of floors: 6L
Order: 2
Board thickness: 1.2mm
Copper thickness: 1oz
Surface treatment: ENIG
Line width and space: 4.0mil / 4.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
3+2+3
Number of floors: 8L
Order: 3
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
3+4+3
Number of floors: 10L
Order: 3
Board thickness: 1.0mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 3.0mil / 3.0mil
Application: Communication
Technical characteristics: Multi-layer heigh plus
1+4+1
Number of floors: 6L
Order: 1
Board thickness: 1.6mm
Copper thickness: 1oz
Surface treatment: ENIG
Line width and distance: 3.5mil / 3.5mil
Application: Car
10-layer third-order blind buried plate
HDI layer : 20L
Minimum mechanical drilling aperture : 0.15mm
Impedance tolerance: ± 8%
Surface treatment: full board OSP, full board immersion gold, OSP + immersion gold, OSP + carbon oil, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, Shen silver
2+2+2
Number of floors: 6L
Order: 2
Board thickness: 0.7mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.3mil / 2.3mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
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