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Four-layer soft-hard combined buried plate (display module)
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Four-layer soft-hard combined buried plate (display module)

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Number of floors: 4L
Board thickness: 0.1
Plate: PI
Product use: camera
Minimum aperture: 0.15mm
Line width and space: 0.061 mil/ 0.06mil
Surface treatment: Enepig
Product serial number
Quantity
-
+
Stock:
0

Number of floors: 4L

Board thickness: 0.1

Plate: PI

Product use: camera

Minimum aperture: 0.15mm

Line width and space: 0.061mil / 0.06mil

Surface treatment: Enepig

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