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First-order eight-layer soft-hard combined buried hole (server)
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First-order eight-layer soft-hard combined buried hole (server)

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The highest number of layers: 14L
Board thickness: 1.0mm
Minimum hole warp: 0.1mm
Surface treatment:Enig+ OSP (anti-oxidation)
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The highest number of layers: 14L

Board thickness: 1.0mm

Minimum hole warp: 0.1mm

Surface treatment: Enig + OSP (anti-oxidation)

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