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High-frequency mixed pressure
Retail price
0.0
元
Market price
0.0
元
Board thickness: 1.5mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.152mil / 0.152mil
Uses: Amplifier
Technical features: The product is used in communication power amplifier modules. The RO4350B is mixed with FR-4. The top metal slot is designed to have a copper-free depth of 0.5mm. The thermal stability of the product is more than three times that of ordinary FR-4.
Product serial number
Category
High layer
Quantity
-
+
Stock:
0
Number of floors: 4L
Board thickness: 1.5mm
Copper thickness: 1oz
Surface treatment: chemical nickel gold
Line width and space: 0.152mil / 0.152mil
Uses: Amplifier
Technical features: The product is used in communication power amplifier modules. The RO4350B is mixed with FR-4. The top metal slot is designed to have a copper-free depth of 0.5mm. The thermal stability of the product is more than three times that of ordinary FR-4.
1

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