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0.0
Number of floors: 8L
Order: 2
Board thickness: 0.8mm
Copper thickness: 1oz
Surface treatment: ENIG + OSP
Line width and space: 2.3mil / 2.3mil
Application: mobile phone
Technical characteristics: Multi-layer heigh plus
Product serial number
Category
HDI
Quantity
-
+
Stock:
0

Number of floors: 8L

Order: 2

Board thickness: 0.8mm

Copper thickness: 1oz

Surface treatment: ENIG + OSP

Line width and space: 2.3mil / 2.3mil

Application: mobile phone

Technical characteristics: Multi-layer heigh plus

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